The University of Tennessee, Knoxville

Joint Institute for Advanced Materials

About the Polisher

Image reproduced with courtesy of Allied High Tech Products, Inc.The capabilities of the Polisher include parallel polishing, angle polishing, site-specific polishing or any combination thereof. It provides reproducible sample results by eliminating inconsistencies between users, regardless of their skill.

Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the pre-defined geometric orientation throughout the grinding/polishing process.

Digital indicators enable quantifiable material removal, which can be monitored real-time, or pre-set for unattended operation. Variable speed rotation and oscillation maximize use of the entire abrasive/polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

Common applications include parallel circuit delayering, cross-sectioning, serial/3-D preparation, wedge polishing and more.

How to use it

Operating the Polisher

  • Make sure that the Multiprep system is properly calibrated using the needle and dial assembly.
  • Heat the cross sectioning paddle on the hot plate.
  • Cut a piece of your sample for polishing.
  • Using wax, melt a small piece of it onto your now heated cross section paddle from Step 2. Then remove the paddle from the hot plate.
  • Place your sample on the paddle and mount the paddle in the Multiprep system.
  • Use a microscope to locate your area of interest on the sample, and ensure that it is located where you need it.
  • Measure the distance from the edge of the sample to the area of interest.
  • Secure your DLF to the platen using water and the rubber squeegee.
  • Attach the cam-lock adapter to the Multiprep and the cross-section paddle to the adapter.
  • Lower the sample with the spindle riser. Then, raise the sample using the vertical adjustment knob, so it will not touch the DLF. Zero the digital dial indicator by pressing the yellow button labeled “Zero.”
  • Make sure that the sample is aligned properly.
  • Once the sample is properly aligned, you can now begin polishing it.
  • Lower the sample onto the abrasive until the digital indicator displays the proper amount of material you want to remove.
  • Raise the sample using the spindle raiser.
  • Activate platen rotation counterclockwise at your necessary rpms.
  • Activate coolant/water and gently lower the sample onto the DLF with the spindle riser and zero the dial indicator.
  • Increase Platen RPM. When the display indicates that you have taken off the amount you want, raise the spindle.
  • Remove your sample and inspect it under a microscope. If it is not the proper size as needed, continue to polish it.
  • Polish your sample until it is the proper width, using finer DFLs to make its surface flatter and better.
  • After you are finished with whichever DLF you are using, clean it with a lint free wipe and place it into the DLF storage book. Be sure to do this for all the DLFs you use.

We also provide PDFs on Cross Sectioning, TEM Cross-Section, Pre FIB TEM, Backside Thinning, Parallel Lapping Integrated Circuits.

For a visual aid, there is the Multiprep System Alignment Video below.



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